Visit Pack Expo booth S1254 where Enercon will showcase new technologies for induction sealing your product. For the first time both rotary and indexing capless sealing systems will be in operation in the Enercon booth. This new technology is ideal for efficiently sealing containers without caps or prior to lidding or over-capping. And with new advancements in coil design, it is now possible to seal round, non-round, square, rectangular, oblong, metal, glass and plastic containers using the capless systems.

Induction sealing provides packagers with an effective alternative to conduction systems. Benefits include “instant start-up”, clean operation and a technology that is more forgiving of container imperfections and variations. Best of all, these ultra-efficient induction sealing components operate at 1/10th the power required by conduction sealing elements.

Also in operation will be the microprocessor controlled Super Seal™ Deluxe which sets new standards for both productivity and ease of use. Its new easy-change "All-in-One" sealing head maximizes sealing versatility and reduces changeover time. The Compak™ Jr will also be in operation to demonstrate the flexibility of the popular table-top sealer.

From table-top to integrated production line applications, Enercon’s sealers reliably provide tamper-evidence, product freshness and leak prevention. Enercon’s specialty sealing head expertise ensures an effective solution for all your difficult to seal products.

Also on display will be the new Dyne-A-MiteTM HP air plasma surface treater which promotes adhesion for a variety of packaging and decorating applications.

Enercon will also be exhibiting at booth M12 Packaging Security Resource Center. Visitors will learn if their product is a candidate for induction sealing tamper-evident security.